SMT Red Adhesive with High Speed Dispensing Machine SE8307

FOB Reference Price:Get Latest Price
US $1-100 / Kilogram | 20 Kilogram/Kilograms (Min. Order)
Supply Ability:
100 Ton/Tons per Month
Port:
Yantai/ Qingdao/Beijing/Shanghai
Report Suspicious Activity
Overview
Quick Details
CAS No.:
25068-38-6
Other Names:
SMT RED ADHESIVE
MF:
C18H21ClO
EINECS No.:
25068
Place of Origin:
Shandong, China (Mainland)
Classification:
Other Adhesives
Main Raw Material:
Epoxy
Usage:
SMT Surface Mount Technology
Brand Name:
SEAYU
Model Number:
SE8307
Type:
Liquid Glue
Product name:
SE8307
Color:
Red
Certificate:
MSDS
Packing:
200g/360g/400g/pc
Packaging & Delivery
Packaging Details
200ml /tube
360ml/tube
400ml/tube
or as your request
Delivery Time
Shipped in 5 days after payment

Production Introduction
SEAYU ® One component epoxy adhesive SE8307 is a kind of heat cured adhesive. It is designed for the drops of high speed machine. High bonding strength ,high heat resistance ,e xcellent electrical performance and good storage stability .

 

Application
Mainly used for the bonding of the mounted components on SMT.

 

 

Properties Uncured

                                          Typical Value                     Range                       Test Standard
Appearance                          Red cream
Chemical Type                     Epoxy Resin
Viscosity (Pa.s) (Brookfield RV)
                       Spindle                7                                250-330                  GB/T 2794-1995
Thixotropic index                        5.8
Density (g/cm3)                         1.28                             1.25-1.3                GB/T 13354-1992
Operate Time at Room Temperature
( day @25 °C )                              7

 

 

Curing Condition Recommended
90-120s at 120 °C .
60-90s at 150 °C
The product will obtain to higher bonding strength when higher curing temperature and longer
cured time .

 

 

 

 

The f igure curve is the recommended curing temperature and heating rate, The time is need
that the components achieve good bonding strength need time at 120 °C or 150 °C .

Users can set the curing furnace ’ s temperature parameters according to the solidified
characteristic curve of the glue and the heat efficiency of the R eflow O vens .

 

Performance After Cured

( Cured for 30min@150 °C )

 


Physical Property                                     Typical Value                              Test Standard
Hardness ( Shore D)                                       83                                        GB/T 2411-1980
Shear Strength ( MPa )                                  15.2                                      GB/T 7124-1986
Tg ( °C )( DSC )                                            98                                         ASTM E1545
Dielectric strength (KV/mm)                           26.5                                  GB /T 40 8.1 - 1999
S urface resistance ( Ω )                             5.6 × 10 16                              GB /T 1410- 2006
V olume resistance ( Ω *cm)                      2.8 × 10 1 5                              GB/T 1410-2006

 

 

 

 

 

 

 

 

 

 

 

Contact information: